INCOMING DOCUMENTATION AND PACKING INSPECTION
This inspection verifies the box damages, ESD protection, type of package, humidity indicator card (HIC) pass H2O test, etc.
This testing is non-destructive and performed in accordance with SAE AS6081, 184.108.40.206.1.
EXTERNAL VISUAL INSPECTION
This inspection verifies the characteristics of electronic parts to evaluate quality and originality.
This includes inceptions such as the condition of the components, part markings, evidence of a secondary coating, lead conditions, dimensions and surface quality.
Visual inspection is non-destructive and performed per SAE AS6081 and MIL-STD-883 Method 2009.9 and on a sample of parts from a given lot base on the sample
according to the ANSI ASQE Z1.4 Table II−A.Common things generally looked for during a visual inspection test of an Integrated Circuit device include:
· Packing material / External visual inspection (MSL; ESD)
· External Microscopic Inspection
· Top Surface Consistency
· Pins Alignment
· Pins oxidation detection
· Font and Logo Consistency
· Physical Removal Test
· Chemical Removal Test
· Components Cracks,Scratches & Contaminants verification
· Surface Finish
· Pin One Indicator
· Traceability & digital records kept of all goods inspected
AC/DC ELECTRICAL TESTING
This Electronic Tests will verify electrical operating conditions of active and passive componets on various types of components from
DC limited function to full DC/AC function .We can simulate test condition depanding on industry compliance requirements(i.e. Military,Automotive,Medical,etc.)
Electrical testing is helpful to :
·evaluate input and output characteristics of components
·compare know"good" devices with unknow devices to provide some a level of examination
·detect failure analysis
The solderability of a substrate is a mesure of the ease with which a soldered joint can be made to that material.
It determine if the components will have soldering issue at the contract manufacturer.
X-ray inspection are non-destructive tests to verify the bond wire connections,die size comparison and ESD damaged .
X-Ray are performed base on AS5553 and MIL-STD-883 2017.7. Counterfeit devices can be determined by comparing
the structure of the die to a known good device,while the tset also analyses:
·Wire Bonding Option
·Check for De-lamination
·Die Size Comparison
·Broken or Missing Bond Wire